Curable polysilsesquioxane compound, method for producing same, curable composition, cured product, and method for using curable composition or the like

摘要

The present invention provides: a curable polysilsesquioxane compound comprising at least one structural unit represented by R¹SiO_3/2 (wherein R¹ is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or a substituted or unsubstituted aryl group), a ²⁹Si nuclear magnetic resonance spectrum of the curable polysilsesquioxane compound having a first peak top within a range of −65 ppm or more and less than −55 ppm, having a second peak top within a range of −73 ppm or more and less than −65 ppm, and having a third peak top within a range of −82 ppm or more and less than −73 ppm, and the ratio of an integral value (P1) of a first peak to the total of the integral value (P1) of the first peak, an integral value (P2) of a second peak, and an integral value (P3) of a third peak being more than 0% and less than 10%; a method for producing the same; a curable composition; a cured product; and a method for using curable composition or the like as an optical device-securing material. According to the present invention, there can be provided: a curable compound that produce a cured product that exhibits excellent heat resistance, and exhibits high adhesion even at a high temperature; a method for producing a curable compound; a cured product obtained by curing the curable composition; and a method for using the curable compound or the curable composition.