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Damage index predicting system and method for predicting damage-related index

机译:损伤指数预测系统和损伤相关指数的预测方法

摘要

A damage index predicting system is for predicting a damage-related index of solder joints of an electronic device having the solder joints that electrically connect an electronic component to a mounting circuit board and one or more detection solder joints that are designed so as to have a shorter life than the solder joints. The system includes: a database configured to store a fracture relationship between the detection solder joints and the solder joints; a fracture detector configured to detect fracture of the detection solder joints; and a processor configured to calculate a prediction value of the damage-related index of the solder joints based on information relating to the fracture of the detection solder joints obtained by the fracture detector and the fracture relationship stored in the database.
机译:损坏指数预测系统用于预测电子设备的焊点的与损坏有关的指数,该电子设备具有将电子部件电连接到安装电路板上的焊点和一个或多个设计成具有焊点的检测焊点。比焊点寿命短。该系统包括:数据库,被配置为存储检测焊点与焊点之间的断裂关系;以及断裂检测器,被配置为检测所述检测焊点的断裂;处理器,被配置为基于与由所述断裂检测器获得的所述检测用焊点的断裂相关的信息和存储在所述数据库中的所述断裂关系,来计算所述焊点的损伤相关指标的预测值。

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