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Patterning of silicon oxide layers using pulsed laser ablation

机译:使用脉冲激光烧蚀图案化氧化硅层

摘要

A method for making an ablated electrically insulating layer on a semiconductor substrate. A first relatively thin layer of at least an undoped glass or undoped oxide is deposited on a surface of a semiconductor substrate having n-type doping. A first relatively thin semiconductor layer having at least one substance chosen from amorphous semiconductor, nanocrystalline semiconductor, microcrystalline semiconductor, or polycrystalline semiconductor is deposited on the relatively thin layer of at least an undoped glass or undoped oxide. At least a layer of borosilicate glass or borosilicate/undoped glass stack is deposited on the relatively thin semiconductor layer. The at least borosilicate glass or borosilicate/undoped glass stack is selectively ablated with a pulsed laser, and the relatively thin semiconductor layer substantially protects the semiconductor substrate from the pulsed laser.
机译:一种在半导体衬底上制造烧蚀的电绝缘层的方法。至少未掺杂的玻璃或未掺杂的氧化物的第一相对较薄的层沉积在具有n型掺杂的半导体衬底的表面上。将具有选自非晶半导体,纳米晶体半导体,微晶半导体或多晶半导体中的至少一种物质的第一相对薄的半导体层沉积在至少未掺杂的玻璃或未掺杂的氧化物的相对薄的层上。在相对较薄的半导体层上沉积至少一层硼硅酸盐玻璃或硼硅酸盐/未掺杂玻璃叠层。至少硼硅酸盐玻璃或硼硅酸盐/未掺杂的玻璃叠层被脉冲激光选择性地烧蚀,并且相对薄的半导体层基本上保护半导体衬底免受脉冲激光的影响。

著录项

  • 公开/公告号US9236510B2

    专利类型

  • 公开/公告日2016-01-12

    原文格式PDF

  • 申请/专利权人 SOLEXEL INC.;

    申请/专利号US201314137172

  • 申请日2013-12-20

  • 分类号H01L21;H01L31/0236;B23K26/06;B23K26/073;B23K26/36;B23K26/40;H01L31/068;H01L31/18;H01L31/056;H01L31/0224;H01L31/0352;H01L31/0445;H01L31/0216;

  • 国家 US

  • 入库时间 2022-08-21 14:31:05

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