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Laser processing head, laser processing apparatus, optical system of laser processing apparatus, laser processing method, and laser focusing method

机译:激光加工头,激光加工装置,激光加工装置的光学系统,激光加工方法以及激光聚焦方法

摘要

A laser cutting apparatus (10) includes a laser processing head (15) that receives a laser beam emitted by a laser oscillator (12) and that uses a spherical lens for converging the laser beam so as to cause the intensity distribution of the laser beam to have a caldera-like shape, in which the intensity of the laser beam is higher in a peripheral area than in a central area, at the position of a workpiece (20). Moreover, the laser processing head (15) radiates the laser beam whose focal position is displaced from the position of the workpiece (20) to the workpiece (20). Therefore, the laser cutting apparatus (10) performs an inversion on the laser beam by using the spherical aberration of the spherical lens. Consequently, with a simple configuration, a laser beam whose inner area and outer area are inverted at the position of the workpiece (2) can be generated, and the processing direction for processing the workpiece (20) is not limited.
机译:激光切割设备( 10 )包括激光处理头( 15 ),该激光处理头接收由激光振荡器( 12 )发射的激光束,并使用球形透镜会聚激光束,以使激光束的强度分布呈破火山口状,其中激光束的强度在外围区域比中心区域高。工件的位置( 20 )。此外,激光加工头( 15 )发射焦点位置从工件( 20 )到工件( 20 < / B>)。因此,激光切割设备( 10 )通过使用球面透镜的球差对激光束进行反转。因此,通过简单的结构,能够产生在工件( 2 )的位置内部和外部区域反转的激光束,从而能够对工件()进行加工。 20 )不受限制。

著录项

  • 公开/公告号US9346126B2

    专利类型

  • 公开/公告日2016-05-24

    原文格式PDF

  • 申请/专利权人 MASAO WATANABE;SHUHO TSUBOTA;

    申请/专利号US201113982790

  • 发明设计人 MASAO WATANABE;SHUHO TSUBOTA;

    申请日2011-05-30

  • 分类号B23K26/06;B23K26/073;B23K26/38;G02B27/40;

  • 国家 US

  • 入库时间 2022-08-21 14:31:05

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