首页> 外国专利> Photonic switch chip for scalable reconfigurable optical add/drop multiplexer

Photonic switch chip for scalable reconfigurable optical add/drop multiplexer

机译:用于可伸缩可重构光分插复用器的光子交换芯片

摘要

System and method embodiments are provided for a photonic switch chip for scalable reconfigurable optical add/drop multiplexer (ROADM). The embodiments enable a low-cost pay as you grow ROADM that scales as both the number of wavelengths added or dropped increases and the size of the node in terms of number of directions increase. In an embodiment, a ROADM includes an M degree optical cross-connect tandem component comprising M wavelength selective switch (WSS) coupled to M wavelength division multiplexing (WDM) node interfaces, where M is equal to a number of input or output directions; a routing stage wavelength selector switch (WSS) comprising a plurality of WSSs connected to the tandem component; and an N by M combiner/distributor for add/drop coupled to the routing stage WSS, wherein the combiner/distributor comprises one or more photonic integrated circuit (PIC) chips, and wherein N is a maximum number of add/drop wavelengths.
机译:提供了用于可伸缩的可重构光分插复用器(ROADM)的光子交换芯片的系统和方法实施例。实施例实现了随着ROADM的增长而产生的低成本支付,ROADM随增加或减少的波长数量增加以及节点的大小(在方向数量上)增加而扩展。在一个实施例中,ROADM包括M度光学交叉连接串联组件,其包括耦合到M个波分复用(WDM)节点接口的M个波长选择开关(WSS),其中M等于输入或输出方向的数量;路由级波长选择器开关(WSS),包括连接到串联组件的多个WSS; N和M的N个组合器/分配器,用于耦合/路由到路由级WSS,其中,该组合器/分配器包括一个或多个光子集成电路(PIC)芯片,并且其中N是最大数目的插/分波长。

著录项

  • 公开/公告号US9215028B2

    专利类型

  • 公开/公告日2015-12-15

    原文格式PDF

  • 申请/专利权人 HUAWEI TECHNOLOGIES CO. LTD.;

    申请/专利号US201314021999

  • 发明设计人 DOMINIC GOODWILL;HAMID MEHRVAR;

    申请日2013-09-09

  • 分类号H04Q11/00;H04J14/02;H04L12/721;

  • 国家 US

  • 入库时间 2022-08-21 14:30:07

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