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Sheet-like adhesive and organic EL panel using the same
Sheet-like adhesive and organic EL panel using the same
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机译:片状粘合剂和使用其的有机EL面板
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摘要
A heat curable sheet-like adhesive for an organic EL panel, comprising components (A) to (C), which has tack in the surface of a composition comprising the components (A) to (C) at 25° C.:the component (A): a film forming component having an epoxy equivalent of 7000 to 20000 g/eq and having compatibility with the component (B);the component (B): an epoxy resin having an epoxy equivalent of 150 to 5000 g/eq and comprising 0 to 20% by weight of a solid epoxy resin at 25° C. with respect to the whole of the component (B); andthe component (C): an encapsulated epoxy adduct-type latent curing agent.展开▼
机译:一种用于有机EL面板的可热固化的片状粘合剂,其包含组分(A)至(C),其在25℃下在包含组分(A)至(C)的组合物的表面具有粘性:组分(A):具有7000至20000 g / eq的环氧当量并与组分(B)具有相容性的成膜组分; ListItem> 组分(B):环氧当量为150至5000 g / eq的环氧树脂,相对于全部环氧树脂,该环氧树脂在25°C下包含0至20 wt%的固体环氧树脂(B)成分;和 ListItem> (C)成分:一种封装的环氧加合物型潜在固化剂。 ListItem> UnorderedList> ListItem> UnorderedList>
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