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Hearing instrument having a routing building block for complex mid structures

机译:具有用于复杂中层结构的布线构件的助听器

摘要

A hearing instrument uses an MID (Molded Interconnect Device) to replace a complexly folded and expensive flexible PCB (Printed Circuit Board) inside hearing aids and enables the use of complex MID frames in hearing instruments. An additional routing building block is provided for the very complex routing around active electronic components, e.g. chips or ASICs and small passive electronic components. It includes a small, preferably rigid mini PCB provided for the complex routing. A large Flex-PCB is therefore replaced by a combination of an MID circuit frame and a mini PCB. The mini PCB enables complex routing of conducting paths and thus helps to increase integration while the MID circuit frame provides for a mechanical structure that enables and alleviates placing and connecting components such as microphones or receivers at respective mounting positions, e.g. at openings of a hearing aid housing.
机译:助听器使用MID(模制互连设备)代替助听器内部的复杂折叠且昂贵的柔性PCB(印刷电路板),并允许在助听器中使用复杂的MID框架。提供了一个额外的路由构建块,用于围绕有源电子组件的非常复杂的路由,例如:芯片或ASIC以及小型无源电子元件。它包括一个小的,最好是刚性的微型PCB,用于复杂的布线。因此,大的Flex-PCB被MID电路框架和迷你PCB的组合所代替。微型PCB能够实现导电路径的复杂布线,从而有助于增加集成度,而MID电路框架提供了一种机械结构,该结构能够并减轻在各个安装位置(例如麦克风或接收器)的放置和连接组件,例如麦克风或接收器。在助听器外壳的开口处。

著录项

  • 公开/公告号US9439007B2

    专利类型

  • 公开/公告日2016-09-06

    原文格式PDF

  • 申请/专利权人 SIVANTOS PTE. LTD.;

    申请/专利号US201514692940

  • 发明设计人 FRANK NAUMANN;

    申请日2015-04-22

  • 分类号H04R25/00;

  • 国家 US

  • 入库时间 2022-08-21 14:28:21

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