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Method for producing electrode material for vacuum circuit breaker, electrode material for vacuum circuit breaker and electrode for vacuum circuit breaker

机译:真空断路器用电极材料的制造方法,真空断路器用电极材料和真空断路器用电极

摘要

The electrode material for a vacuum circuit breaker is produced by a method comprising a mixing step, a press sintering step, and a Cu infiltration step. In the mixing step, an Mo powder having a particle diameter of 0.8 to 6 μm is homogeneously mixed with a thermite Cr powder having a particle diameter of 40 to 300 μm in such a manner as giving a mixing ratio (Mo:Cr) of 1:1 to 9:1 and satisfying the weight relation Mo≧Cr. In the press sintering step, the resultant mixture is pressure molded under a press pressure of 1 to 4 t/cm2 to give a molded article. Next, said molded article is sintered by maintaining the same at a temperature of 1100 to 1200° C. for 1 to 2 hours in an heating furnace to give a partially sintered article. In the Cu infiltration step, a thin Cu plate is placed on said partially sintered article and maintained at a temperature of 1100 to 1200° C. for 1-2 hours in a heating furnace so that Cu is liquid-phase sintered and infiltrated into the partially sintered article. A contact material of an electrode for a vacuum circuit breaker has an integral structure consisting of a central member and a Cu—Cr outer peripheral member, said central member having been produced as described above and comprising 30 to 50 wt % of Cu of a particle diameter of 20 to 150 μm and 50 to 70 wt % of Mo—Cr of a particle diameter of 1 to 5 μm, while said outer peripheral member being formed of a material, which is highly compatible with the central member, shows excellent interruption performance and has high withstand voltage, and being provided outside the central member and fixed thereto.
机译:用于真空断路器的电极材料通过包括混合步骤,压制烧结步骤和Cu渗透步骤的方法来制造。在混合步骤中,以使得混合比(Mo:Cr)为1的方式将粒径为0.8至6μm的Mo粉末与粒径为40至300μm的铝热剂Cr粉末均匀地混合。 1:1至9:1并且满足重量关系Mo≥Cr。在压制烧结步骤中,将所得混合物在1至4t / cm 2 的压制压力下进行压制成型,从而得到成型品。接下来,通过在加热炉中将其在1100至1200℃的温度下保持1-2小时来烧结所述模制品,以得到部分烧结的制品。在Cu渗透步骤中,将薄的Cu板放置在所述部分烧结的制品上,并在加热炉中在1100至1200℃的温度下保持1-2小时,以使Cu被液相烧结并渗透到炉中。部分烧结的物品。用于真空断路器的电极的接触材料具有由中央构件和Cu-Cr外周构件组成的整体结构,所述中央构件如上所述制造,并且包含30至50wt%的颗粒Cu。所述外周构件由直径为20μm至150μm的Mo-Cr和50wt%至70wt%的颗粒直径为1μm至5μm,而所述外周构件由与中央构件高度相容的材料形成,显示出优异的中断性能并且具有高耐压,并且设置在中央构件的外部并固定在中央构件上。

著录项

  • 公开/公告号US9281136B2

    专利类型

  • 公开/公告日2016-03-08

    原文格式PDF

  • 申请/专利权人 YASUSHI NODA;HIROMASA SATO;

    申请/专利号US201113806568

  • 发明设计人 HIROMASA SATO;YASUSHI NODA;

    申请日2011-06-20

  • 分类号B22F3/26;H01H1/02;C22C1/04;C22C9/00;C22C27/04;C22C30/02;H01B1/02;H01B13/00;H01H1/06;H01H33/664;

  • 国家 US

  • 入库时间 2022-08-21 14:27:55

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