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Infrared light sensor chip with high measurement accuracy and method for producing the infrared light sensor chip

机译:测量精度高的红外线传感器芯片及其制造方法

摘要

An infrared light sensor chip comprises a substrate (2), an infrared light sensor (9), which has a base electrode (10) that is in direct contact with one side (8) of the substrate (2) and which is used to attach the infrared light sensor (9) to the substrate (2), and a resistance thermometer (13), which has a resistance path (14) in direct contact with the side (8) of the substrate (2) adjacent to the infrared light sensor (9) and configured to measure the temperature of the substrate (2) via the resistance thermometer (13). The resistance path (14) is made of the same material of which the base electrode (10) is made.
机译:红外光传感器芯片包括基板( 2 ),红外光传感器( 9 ),该红外光传感器的基极( 10 )与基板( 2 )的一侧( 8 )直接接触,用于附着红外光传感器( 9 )到基板( 2 )和电阻温度计( 13 ),该温度计的电阻路径( 14 )与侧面直接接触基板( 2 )的( 8 )与红外光传感器( 9 )相邻,并配置为测量基板的温度(< B> 2 )通过电阻温度计( 13 )。电阻路径( 14 )由与基础电极( 10 )相同的材料制成。

著录项

  • 公开/公告号US9207126B2

    专利类型

  • 公开/公告日2015-12-08

    原文格式PDF

  • 申请/专利权人 PYREOS LTD.;

    申请/专利号US201414309204

  • 发明设计人 CARSTEN GIEBELER;

    申请日2014-06-19

  • 分类号G01J5/02;G01J5/34;G01J5/10;G01J5/06;

  • 国家 US

  • 入库时间 2022-08-21 14:27:47

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