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NEW MICROCHANNEL HEAT SINK FOR THERMAL MANAGEMENT OF DEVICES

机译:用于设备热管理的新型微通道热沉

摘要

A micro channel structure for use in a heat sink is disclosed. The micro channel structure includes a first to forth set of micro channels, each set of micro channel are in the form of semi-rectangle section, wherein: the first and the second set of micro channels are arranged as mirror images with respect to a vertical axis; and the third and the fourth set of micro channels are arranged as mirror images with respect to said vertical axis. Further, the first and the third set of micro channels are arranged as mirror images with respect to a horizontal axis; and the second and the fourth set of micro channels are arranged as mirror images with respect to said horizontal axis. Figure 2
机译:公开了一种用于散热器的微通道结构。所述微通道结构包括第一至第四组微通道,每组微通道均呈半矩形截面的形式,其中:所述第一和第二组微通道相对于垂直方向布置成镜像。轴;第三和第四组微通道相对于所述垂直轴布置成镜像。此外,第一组微通道和第三组微通道相对于水平轴布置为镜像;第二和第四组微通道相对于所述水平轴布置成镜像。图2

著录项

  • 公开/公告号IN2013CH02252A

    专利类型

  • 公开/公告日2016-06-17

    原文格式PDF

  • 申请/专利权人

    申请/专利号IN2252/CHE/2013

  • 发明设计人 VINODHAN LEELA;RAJAN K S;

    申请日2013-07-23

  • 分类号

  • 国家 IN

  • 入库时间 2022-08-21 14:25:42

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