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NEW MICROCHANNEL HEAT SINK FOR THERMAL MANAGEMENT OF DEVICES
NEW MICROCHANNEL HEAT SINK FOR THERMAL MANAGEMENT OF DEVICES
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机译:用于设备热管理的新型微通道热沉
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摘要
A micro channel structure for use in a heat sink is disclosed. The micro channel structure includes a first to forth set of micro channels, each set of micro channel are in the form of semi-rectangle section, wherein: the first and the second set of micro channels are arranged as mirror images with respect to a vertical axis; and the third and the fourth set of micro channels are arranged as mirror images with respect to said vertical axis. Further, the first and the third set of micro channels are arranged as mirror images with respect to a horizontal axis; and the second and the fourth set of micro channels are arranged as mirror images with respect to said horizontal axis. Figure 2
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