HIGH-POWER HIGH-TEMPERATURE WHITE LIGHT LED PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

A high-power high-temperature white light LED package, comprising a blue light chip (1), a Ce:YAG solid state fluorescent material (2), and a packaging frame surrounding the blue light chip and the Ce:YAG solid state fluorescent material (2); the Ce:YAG solid state fluorescent material (2) is bonded overlaying the blue light chip (1). A manufacturing method of a high-power high-temperature white light LED package. The high-power high-temperature white light LED package manufactured employing the above technical solution attaches the solid state fluorescent material directly to the high-power blue light chip (1) via a frame structure, and utilizes a lens principle to combine the blue light of the chip and the yellow-green light converted and emitted by the chip, thus obtaining white light. The high-power high-temperature white light LED package structure does not need adhesive, has high fluorescence efficiency, and can work at a temperature above 150 degrees.