首页> 外国专利> OLED COMPONENT PACKAGING METHOD, OLED DISPLAY PANEL, AND OLED DISPLAY DEVICE

OLED COMPONENT PACKAGING METHOD, OLED DISPLAY PANEL, AND OLED DISPLAY DEVICE

机译:OLED组件包装方法,OLED显示面板和OLED显示装置

摘要

An OLED display panel, an OLED display device, and an OLED component packaging method. The OLED display panel comprises: a first substrate (1); a second substrate (6) disposed opposite to the first substrate (1); and a heat-conducting layer (2), a first packaging adhesive (3), a second packaging adhesive (4), and an OLED component (7) that are located between the first substrate (1) and the second substrate (6). The first packaging adhesive (3) is located between the first substrate (1) and the second substrate (6) and forms a sealed space with the first substrate (1) and the second substrate (6). The heat-conducting layer (2) is formed in an area encircled by the first packaging adhesive (3) and comprises at least two areas (21, 22) with different heat-conducting properties. At least the heat-conducting property of the marginal area of the heat-conducting layer (2) is better than the heat-conducting property of the central area. The second packaging adhesive (4) is filled in the sealed space formed by the first substrate (1), the second substrate (6), and the first packaging adhesive (3) and makes contact with the surface of the heat-conducting layer (2). By means of the heat-conducting layer, the second packaging adhesive in contact with the heat-conducting layer is allowed to generate a temperature difference at the central area and the marginal area, and furthermore, the diffusing speed of the second packaging adhesive from the center to the periphery is controlled, thereby preventing the second packaging adhesive from causing damage to the first packaging adhesive, guaranteeing the water-blocking and oxygen-blocking performance of the first packaging adhesive, and prolonging the service life of the OLED component.
机译:OLED显示面板,OLED显示装置和OLED组件封装方法。 OLED显示面板包括:第一基板(1);以及第一基板(1)。与第一基板(1)相对设置的第二基板(6);导热层(2),位于第一基板(1)和第二基板(6)之间的第一包装胶(3),第二包装胶(4)和OLED组件(7)。 。第一包装粘合剂(3)位于第一基板(1)和第二基板(6)之间,并与第一基板(1)和第二基板(6)形成密封空间。导热层(2)形成在由第一包装粘合剂(3)环绕的区域中,并且包括至少两个具有不同导热性质的区域(21、22)。至少导热层(2)的边缘区域的导热性比中心区域的导热性好。将第二包装粘合剂(4)填充在由第一基板(1),第二基板(6)和第一包装粘合剂(3)形成的密封空间中,并与导热层(C)的表面接触。 2)。借助于导热层,与导热层接触的第二包装粘合剂被允许在中心区域和边缘区域产生温度差,并且第二包装粘合剂从导热区域的扩散速度。通过控制中心至周边的中心,从而防止第二包装胶粘剂对第一包装胶粘剂造成损坏,保证了第一包装胶粘剂的阻水和阻氧性能,并延长了OLED组件的使用寿命。

著录项

  • 公开/公告号WO2015196600A1

    专利类型

  • 公开/公告日2015-12-30

    原文格式PDF

  • 申请/专利权人 BOE TECHNOLOGY GROUP CO. LTD.;

    申请/专利号WO2014CN87199

  • 发明设计人 SONG WENFENG;

    申请日2014-09-23

  • 分类号H01L51/52;H01L51/56;H01L27/32;

  • 国家 WO

  • 入库时间 2022-08-21 14:19:56

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号