CONTACTING EMBEDDED ELECTRONIC COMPONENT VIA WIRING STRUCTURE IN A COMPONENT CARRIER'S SURFACE PORTION WITH HOMOGENEOUS ABLATION PROPERTIES

摘要

A component carrier (100) for carrying electronic components (104), wherein the component carrier (100) comprises an at least partially electrically insulating core (102), at least one electronic component (104) embedded in the core (102), and a coupling structure (106, 202) with at least one electrically conductive through-connection (108) extending at least partially therethrough and having a component contacting end (112) and a wiring contacting end (114), wherein the at least one electronic component (104) is electrically contacted directly to the component contacting end (112), wherein at least an exterior surface portion of the coupling structure (106, 202) has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure (110), and wherein the wiring contacting end (114) is electrically contacted directly to the wiring structure (110).