method of coating phosphor on LED chip

摘要

The present invention relates to a method of applying a phosphor of a light emitting diode chip, comprising the steps of: adsorbing a plurality of light emitting diode chips on a bottom surface of a main vacuum adsorption plate so that a phosphor coated surface of the light emitting diode chip is exposed at the bottom; Forming a phosphor by screen printing at a position corresponding to the arrayed light emitting diode chips adsorbed on the plate, applying a bonding agent on the phosphor, and processing the phosphor to mutually bond the light emitting diode chip to the light emitting diode chip through the bonding agent . According to the method of applying the phosphor of the light emitting diode chip, unnecessary waste of the phosphor is suppressed by forming the phosphor on the support film by screen printing in advance in correspondence with the application region of the light emitting diode chip and joining to the light emitting diode chips, It provides the advantage of securing the property.