首页> 外国专利> MULTILAYERED RADIATION SHIELDING THIN-FILM COMPOSITE MATERIALS MADE BY UNIFORM OR MULTI-SIZED NON-LEADED TUNGSTEN PARTICLES ON WHICH POLYMERS WERE SYNTHESIZED FOR UNIFORM DISPERSION OF THE PARTICLES IN THE SAME POLYMER OR COMPATIBLE POLYMER

MULTILAYERED RADIATION SHIELDING THIN-FILM COMPOSITE MATERIALS MADE BY UNIFORM OR MULTI-SIZED NON-LEADED TUNGSTEN PARTICLES ON WHICH POLYMERS WERE SYNTHESIZED FOR UNIFORM DISPERSION OF THE PARTICLES IN THE SAME POLYMER OR COMPATIBLE POLYMER

机译:在相同聚合物或相容聚合物中合成均匀分散的聚合物时,通过均匀或多层无铅钨微粒制成的多层辐射屏蔽薄膜复合材料

摘要

The present invention relates to a multilayer radiation-shielding material having a maximized shielding function, and a method for producing the same. More specifically, a polymer chain is polymerized on a surface of a metal powder (tungsten) having multiple size distributions with a radiation-shielding function. The same is mixed with an identical polymer resin or a polymer resin having miscibility, so tungsten particles may be uniformly dispersed. Moreover, there is no pin hole, and a shielding material like the same is laminated in a multilayer structure or pasted with a tungsten sheet, so a radiation-shielding function is maximized through a lamination structure without using a toxic material such as lead.
机译:具有最大化屏蔽功能的多层辐射屏蔽材料及其制备方法技术领域本发明涉及一种具有最大化屏蔽功能的多层辐射屏蔽材料及其制备方法。更具体地,聚合物链在具有辐射屏蔽功能的具有多种尺寸分布的金属粉末(钨)的表面上聚合。将它们与相同的聚合物树脂或具有混溶性的聚合物树脂混合,因此钨颗粒可以均匀地分散。此外,由于没有针孔,并且将类似的屏蔽材料层压在多层结构中或粘贴有钨片,因此通过层压结构可最大化辐射屏蔽功能,而无需使用铅等有毒材料。

著录项

  • 公开/公告号KR20160010729A

    专利类型

  • 公开/公告日2016-01-28

    原文格式PDF

  • 申请/专利权人 SNU R&DB FOUNDATION;

    申请/专利号KR20140090522

  • 发明设计人 SEO YONG SOK;

    申请日2014-07-17

  • 分类号G21F1/08;G21F1/12;

  • 国家 KR

  • 入库时间 2022-08-21 14:15:13

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