PRESSURE TYPE ELECTROLESS PLATING DEVICE AND ELECTROLESS PLATING METHOD USING SAME

摘要

The present invention relates to a pressure type electroless plating device and an electroless plating method using the same, which are to plate a surface of an object to be plated and an entirety of an inside of a blow hole with metal by soaking a porous ceramic object with a plurality of microscale blow holes or a plurality of nanoscale fine blow holes in a plating solution while the porous ceramic object is fixated in a vacuum suction method such that the plating solution is electroless-plated while passing through the surface of the object and the inside of the fine blow hole by a suction force. According to the present invention, the pressure type electroless plating device comprises: a suction container connected to a vacuum pump generating the suction force; a suction hose wherein one end is connected to the suction container and an other end grips the object to be plated by the suction force; and a plating bath storing the plating solution wherein the object is soaked while the suction hose grips the object to be plated.;COPYRIGHT KIPO 2016