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COMPOUND SUITABLE FOR PHOTOPOLYMERIZATION INITIATOR, PHOTOPOLYMERIZATION INITIATOR, AND PHOTOCURABLE RESIN COMPOSITION
COMPOUND SUITABLE FOR PHOTOPOLYMERIZATION INITIATOR, PHOTOPOLYMERIZATION INITIATOR, AND PHOTOCURABLE RESIN COMPOSITION
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机译:适用于光聚合引发剂,光聚合引发剂和可光固化树脂组合物的化合物
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摘要
The present invention relates to a sealing agent for electronic parts and the like, particularly a compound which can be used for a photopolymerization initiator having photo-curability in a visible region, which is difficult to generate outgas suitable for a liquid crystal sealing agent, a photopolymerization initiator containing the compound, To provide a resin composition. (1) A compound obtained by reacting an organic acid compound and / or a hydroxy compound with a compound containing at least two epoxy groups in the molecule, wherein the compound is a compound A wherein the organic acid compound is dimethylaminobenzoic acid or the compound Lt; RTI ID = 0.0 compound / RTI (2) A photopolymerization initiator comprising a photo initiator compound and a visible light sensitizer, wherein the photo initiator compound is the compound A and the visible light sensitizer compound is the photopolymerization initiator. (3) a photocurable resin composition comprising a photopolymerizable monomer or oligomer and the photopolymerization initiator according to (2).
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