首页> 外国专利> COMPOUND SUITABLE FOR PHOTOPOLYMERIZATION INITIATOR, PHOTOPOLYMERIZATION INITIATOR, AND PHOTOCURABLE RESIN COMPOSITION

COMPOUND SUITABLE FOR PHOTOPOLYMERIZATION INITIATOR, PHOTOPOLYMERIZATION INITIATOR, AND PHOTOCURABLE RESIN COMPOSITION

机译:适用于光聚合引发剂,光聚合引发剂和可光固化树脂组合物的化合物

摘要

The present invention relates to a sealing agent for electronic parts and the like, particularly a compound which can be used for a photopolymerization initiator having photo-curability in a visible region, which is difficult to generate outgas suitable for a liquid crystal sealing agent, a photopolymerization initiator containing the compound, To provide a resin composition. (1) A compound obtained by reacting an organic acid compound and / or a hydroxy compound with a compound containing at least two epoxy groups in the molecule, wherein the compound is a compound A wherein the organic acid compound is dimethylaminobenzoic acid or the compound Lt; RTI ID = 0.0 compound / RTI (2) A photopolymerization initiator comprising a photo initiator compound and a visible light sensitizer, wherein the photo initiator compound is the compound A and the visible light sensitizer compound is the photopolymerization initiator. (3) a photocurable resin composition comprising a photopolymerizable monomer or oligomer and the photopolymerization initiator according to (2).
机译:电子部件用密封剂技术领域本发明涉及电子部件用密封剂,特别是可用于在可见光区域具有光固化性,难以产生适合于液晶密封剂的除气的光聚合引发剂的化合物。含有该化合物的光聚合引发剂,提供树脂组合物。 (1)通过使有机酸化合物和/或羟基化合物与在分子中包含至少两个环氧基的化合物反应而获得的化合物,其中该化合物为其中有机酸化合物为二甲基氨基苯甲酸的化合物A或化合物Lt ; (2)一种光聚合引发剂,其包含光引发剂化合物和可见光敏化剂,其中所述光引发剂化合物为化合物A,所述可见光敏化剂化合物为光聚合引发剂。 (3)一种光固化性树脂组合物,其包含光聚合性单体或低聚物和根据(2)的光聚合引发剂。

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