HEAT-RESISTANT POLYIMIDE ADHESIVE HAVING LOW DIELECTRIC CONSTANT AND FLEXIBLE COPPER CLAD LAMINATE USING SAME

摘要

The present invention discloses a heat-resistant polyimide adhesive which exhibits satisfactory heat resistance and adhesive ability while having a low dielectric constant which can serve to reduce the time delay in the signal speed due to lowering of the dielectric constant, and to a flexible copper clad laminate using the same. The flexible copper clad laminate having a low dielectric constant, according to the present invention, comprises: a polyimide heat-resistant film; a polyimide heat-resistant adhesive layer, attached on the polyimide heat-resistant film; and a copper foil, attached on the polyimide heat-resistant adhesive layer, wherein the polyimide heat-resistant film and polyimide heat-resistant adhesive layer are each a polyimide heat-resistant adhesive comprising a polymer nanoparticle and at least one of an acid dianhydride and a diamine; a fluorine-containing aromatic group or a cycloaliphatic group is used for each of the acid dianhydride and diamine; the fluorine-containing aromatic diamine is an aromatic diamine to which a fluorine atom is added; the fluorine-containing aromatic diamine or the cycloaliphatic diamine is added at 10-50 parts by weight with respect to 100 parts by weight of the total polyimide heat-resistant adhesive; the polymer nanoparticle is added as a solid at 5-20 parts by weight with respect to 100 parts by weight of the total polyimide heat-resistant adhesive; the polymer nanoparticle has an average diameter of 1-100 nm; the polymer nanoparticle is polytetrafluoroethylene (PTTE); and the polyimide heat-resistance adhesive has a dielectric constant of 3.0 or below at 1 GHz.;COPYRIGHT KIPO 2016