DEPOSITING APPARATUS, DEPOSITING METHOD, AND APPARATUS FOR DEPOSITING PROTECTION LAYER

摘要

The present invention relates to a depositing apparatus, a depositing method and an apparatus for depositing a protection layer, and more particularly, to a depositing apparatus which is capable of depositing a plurality of material layers in a single chamber, a depositing method thereof and an apparatus for depositing a protection layer using the same. The depositing apparatus includes: a substrate support configured to support a substrate; a depositing module placed corresponding to a deposition surface of the substrate and disposed in parallel to a first axis direction crossing the substrate, wherein the deposition module includes a plurality of linear atomic layer deposition sources for depositing a first material layer and at least one linear chemical vapor deposition source for depositing a second material layer; and a driving unit connected to the substrate support to reciprocate the substrate support in a second axis direction crossing the first axis direction.;COPYRIGHT KIPO 2016