PHOSPHONIUM BASED COMPOUND, EPOXY RESIN COMPOSITION COMPRISING PHOSPHONIUM BASED COMPOUND, AND SEMICONDUCTOR DEVICE MANUFACTURED USING EPOXY RESIN COMPOSITION

摘要

The present invention relates to a phosphonium based compound represented by chemical formula 1. In chemical formula 1, R_1, R_2, R_3, and R_4 each independently are a substituted or nonsubstituted C_1-C_30 aliphatic hydrocarbon group, a substituted or nonsubstituted C_6-C_30 aromatic hydrocarbon group, or a substituted or nonsubstituted C_1-C_30 hydrocarbon group including hetero atoms; X_1 and X_2 each independently is a substituted or nonsubstituted C_6-C_30 arylene group, a substituted or nonsubstituted C_3-C_10 cycloalkylene group, and a substituted or nonsubstituted C_1-C_20 alkylene group; R_5 and R_6, which are not identical to each other, each independently is hydrogen, a hydroxy group, a C_1-C_20 alkyl group, a C_6-C_30 aryl group, a C_3-C_30 heteroaryl group, a C_3-C_10 cycloalkyl group, a C_3-C_10 heterocycloalkyl group, a C_7-C_30 arylalkyl group, and a C_1-C_30 heteroalkyl group; and m is an integer of 1 to 2. The present invention provides a phosphonium based compound which is capable of accelerating hardening of epoxy resins, has excellent flowability during molding, exhibits high hardening strength, is capable of being hardened even for a short hardening time, is capable of accelerating hardening of the epoxy resins even at low temperatures and has high storage stability, an epoxy resin composition comprising the phosphonium based compound, and a semiconductor device comprising the epoxy resin composition.;COPYRIGHT KIPO 2016