SHEET FOR SEMICONDUCTOR-RELATED-MEMBER PROCESSING AND PROCESS FOR PRODUCING CHIP USING SAID SHEET

摘要

It is possible to improve the releasability of the sheet for processing a semiconductor-related member and to prevent the reliability of the member including the chip made of the semiconductor-related member from being deteriorated by using the sheet for processing a semiconductor- A member-processing sheet (1) comprising a substrate (2) and a pressure-sensitive adhesive layer (3) formed on one surface of the substrate (2), wherein the pressure- At least one kind of energy ray polymerizable compound is a polymerizable branched polymer which is a polymer having a branched structure and is a polymerizable branched polymer containing an energy ray polymerizable compound having a functional group, Is applied to the mirror surface of the silicon wafer and the energy ray is irradiated to the semiconductor-related-member-processing sheet (1) to form a pressure-sensitive adhesive layer (1) obtained by peeling the semiconductor-related-member-processing sheet (1) from the silicon wafer after the adhesion of the semiconductor-related-member processing sheet (3) is lowered, , A temperature of 25 DEG C and a relative humidity of 50%, a contact angle measured by using water droplets is 40 DEG or less.