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A method of making a plurality of surface mount substrates, disposing a plurality of surface mount substrates, and surface mount substrate
A method of making a plurality of surface mount substrates, disposing a plurality of surface mount substrates, and surface mount substrate
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机译:一种制造多个表面安装基板,设置多个表面安装基板的方法以及表面安装基板的方法
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摘要
A method of producing a multiplicity of surface-mountable carrier devices includes: A) providing a carrier plate having a first main face and a second main face located opposite the first main face, B) applying an electrically conductive layer to the first main face, C) applying a solder resist mask to a side of the electrically conductive layer remote from the carrier plate, wherein a multiplicity of adjoining regions are formed on the electrically conductive layer by the solder resist mask, D) applying a solder material to the solder resist mask and the electrically conductive layer, wherein the solder resist mask and the electrically conductive layer are at least partially covered by the solder material, and E) singulating the carrier plate and the electrically conductive layer along and through the solder resist mask and the solder material, wherein the solder material remains at least partially on the solder resist mask.
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