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HIGHLY-THERMALLY-CONDUCTIVE RESIN COMPOSITION, AND RESIN MATERIAL FOR HEAT DISSIPATION/HEAT TRANSFER AND THERMALLY CONDUCTIVE FILM COMPRISING SAME
HIGHLY-THERMALLY-CONDUCTIVE RESIN COMPOSITION, AND RESIN MATERIAL FOR HEAT DISSIPATION/HEAT TRANSFER AND THERMALLY CONDUCTIVE FILM COMPRISING SAME
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机译:高导热性树脂组合物,用于散热/传热和包含相同导热膜的树脂材料
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摘要
The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.
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机译:本发明涉及:(i)具有优异的导热性并且能够被加工成薄壁且挠性的模制品的树脂组合物,该树脂组合物包含:(a)由40至60mol%的丙烯酸组成的树脂。具有联苯基的单元(A)和5至40mol%的线性单元(B)和5至40mol%的线性单元(C),其中树脂本身的导热率不小于0.4 W /(m·K); (b)导热系数不小于1 W /(m·K)的无机填料,(ii)包含树脂组合物的散热或导热树脂材料,和(iii)导热膜树脂组合物。
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