A HEAT TRANSFER DEVICE FOR INCREASING COOLING RATE OF AN INJECTION MOULD

摘要

The present invention describes a heat transfer device (100) for increasing cooling rate of an injection mould (200). The injection mould has a first half (220) and a second half (230) with cooling channels (210) configured around a mould cavity. Coolant is circulated through the cooling channels for cooling. According to the improvement of the present invention the heat transfer device is disposed inside the cooling channel at predefined portion. Further, the heat transfer device partially covers the portion of the cooling channel for increasing heat transfer rate from the portion of the cooling channel to the coolant circulating therein thereby increases cooling rate of the injection mould.