首页>
外国专利>
CHIP ON CHIP ATTACH (PASSIVE IPD AND PMIC) FLIP CHIP BGA USING NEW CAVITY BGA SUBSTRATE
CHIP ON CHIP ATTACH (PASSIVE IPD AND PMIC) FLIP CHIP BGA USING NEW CAVITY BGA SUBSTRATE
展开▼
机译:使用新的腔体BGA基板的芯片连接芯片(被动IPD和PMIC)芯片芯片BGA
展开▼
页面导航
摘要
著录项
相似文献
摘要
An integrated passive device and power management integrated circuit are directly connected, active surface to active surface, resulting in a pyramid die stack. The die stack is flip-chip attached to a laminate substrate having a cavity drilled therein wherein the smaller die fits into the cavity. The die to die attach is not limited to IPD and PMIC and can be used for other die types as required.
展开▼