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SPUTTERING TARGET COMPRISING Ni-P ALLOY OR Ni-Pt-P ALLOY AND PRODUCTION METHOD THEREFOR
SPUTTERING TARGET COMPRISING Ni-P ALLOY OR Ni-Pt-P ALLOY AND PRODUCTION METHOD THEREFOR
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机译:包含Ni-P合金或Ni-Pt-P合金的溅射靶及其生产方法
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摘要
A method of producing a Ni-P alloy sputtering target, wherein a Ni-P alloy having a P content of 15 to 21 wt% and remainder being Ni and unavoidable impurities is melted and atomized to prepare a Ni-P alloy atomized powder having an average grain size of 100 μm or less, the Ni-P alloy atomized powder is mixed with a pure Ni atomized powder, and the obtained mixed powder is hot pressed. An object of the present invention is to provide a method of producing a Ni-P alloy sputtering target which achieves a small deviation from an intended composition.
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