首页> 外国专利> ADDITION ONE LIQUID HEATING CURABLE THERMAL CONDUCTIVE SILICONE GREASE COMPOSITION AND MANUFACTURING METHOD OF CURED ARTICLE THEREOF

ADDITION ONE LIQUID HEATING CURABLE THERMAL CONDUCTIVE SILICONE GREASE COMPOSITION AND MANUFACTURING METHOD OF CURED ARTICLE THEREOF

机译:一种液体加热固化的导热硅脂的组成及其制备方法

摘要

PROBLEM TO BE SOLVED: To provide an addition one liquid heating curable thermal conductive silicone grease composition high in shape maintenance property even with low viscosity at beginning, soft after heating curing, good in adhesiveness to a substrate and capable of ordinary temperature storage and a manufacturing method of a cured article thereof.SOLUTION: There is provided an addition one liquid heating curable thermal conductive silicone grease composition essentially containing (A) alkenyl group-containing organopolysiloxane having viscosity at 25°C of 50 to 100,000 mPa s, (B) liquid organo hydrogen polysiloxane having viscosity at 25°C of 100 mPa s or less, 2 to 10 Si-H groups, an alkoxy group and/or an epoxy group, a polymerization degree of 15 or less and a polysiloxane skeleton having a ring structure, (C) a specific optical active type platinum complex curing catalyst, (D) a thermal conductive filler having thermal conductivity of 10 W/m °C or more, having viscosity at 25°C of 30 to 800 Pa s when rolling number 10 rpm measurement by a Malcom viscometer and capable of ordinary temperature storage.SELECTED DRAWING: None
机译:解决的问题:提供另外一种液体加热可固化的导热硅脂组合物,该组合物即使在开始时仍具有低粘度,在加热固化后柔软,对基材的粘附性好并且能够在常温下储存和制造,仍具有良好的形状保持性。解决方案:提供另外的一种液体加热可固化的导热硅脂组合物,其基本上包含(A)在25℃下粘度为50至100,000mPa s的含烯基的有机聚硅氧烷,(B)液体25℃下的粘度为100mPa·s以下,2〜10个Si-H基,烷氧基和/或环氧基,聚合度为15以下,具有环状结构的聚硅氧烷骨架的有机氢聚硅氧烷, (C)特定的光学活性型铂络合物固化催化剂,(D)导热率为10 W / m°C或更高,在25°C粘度的导热填料马尔康粘度计以10 rpm的转速测量并能够在常温下存储时,最大30至800 Pa s。

著录项

  • 公开/公告号JP2017165791A

    专利类型

  • 公开/公告日2017-09-21

    原文格式PDF

  • 申请/专利权人 SHIN ETSU CHEM CO LTD;

    申请/专利号JP20160049069

  • 发明设计人 IWATA MITSUHIRO;

    申请日2016-03-14

  • 分类号C08L83/07;C08L83/05;C08L83/04;C08K3/36;C08K9;C09K5/14;

  • 国家 JP

  • 入库时间 2022-08-21 14:01:39

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