JOINT BODY OF Cu-BASES BASE MATERIAL WITH Zn-Al BASES ALLOY JOINTED BY CLAD MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a joint body of a semiconductor element with a substrate jointed by a clad material having a high joint strength and excellent in stress relaxation property, and in thermal conductivity.;SOLUTION: A joint body, comprising a semiconductor chip 1 jointed with a substrate 3 by a clad material 2, keeps the face on the semiconductor chip 1 side narrower than the face on the clad material 2 side on both faces where the semiconductor chip 1 and the clad material 2 face each other, and the clad material 2 has a Pb-free-Zn-Al based alloy solder layer 22 on a face of a tabular Cu-based base material 21 to face at least the semiconductor chip 1. The Zn-Al based alloy solder layer 22 preferably contains Al by 0.9 mass% or more and 9.0 mass% or less, and more preferably contains one kind or more of Ag, Cu,Ge, Mg, Sn, and P in a predetermined amount.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2017,JPO&INPIT