ELECTROPLATING METHOD OF PHOTORESIST DEFINED FEATURE FROM ELECTRO COPPER PLATING BATH CONTAINING REACTION PRODUCT OF IMIDAZOLE COMPOUND, BISEPOXIDE AND HALO BENZYL COMPOUND

摘要

PROBLEM TO BE SOLVED: To provide a copper/photoresist defined feature having practically uniform form and having practically no nodule, where a copper pillar and a bond pad have a practically flat profile, and an electro copper plating bath and a method making average %TIR for achieving desired form available.SOLUTION: A electroplating method capable of plating a photoresist defined feature having a practically uniform form includes an electro copper plating bath using a reaction product of an imidazole compound, bisepoxide and a halo benzyl compound for electroplating the photoresist defined feature. Such feature includes a pillar, a bond pad and a line width/interline feature.SELECTED DRAWING: Figure 1