POLYMER FINE PARTICLE, MANUFACTURING METHOD THEREFOR, EPOXY RESIN COMPOSITION AND SEMICONDUCTOR ENCAPSULATION MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a polymer fine particle useful as a powdery stress-lowering agent excellent in heat resistance, having low elasticity and no aggregate, an epoxy resin composition where the polymer fine particle is dispersed uniformly and a semiconductor encapsulation material using the epoxy resin composition.;SOLUTION: There is provided a polymer fine particle consisting of a thermoplastic styrenic elastomer and having average particle diameter of 0.5 μm to 100 μm and narrow particle diameter distribution. Elasticity modulus is reduced by dispersing the polymer fine particle in an epoxy resin composition as a stress-lowering agent uniformly and then a material useful as an additive for semiconductor encapsulation material can be obtained.;SELECTED DRAWING: None;COPYRIGHT: (C)2017,JPO&INPIT