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POLYCARBOXYLIC ACID RESIN AND POLYCARBOXYLIC ACID RESIN COMPOSITION COMPRISING THE SAME, EPOXY RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF THE SAME, AND SEMICONDUCTOR DEVICE
POLYCARBOXYLIC ACID RESIN AND POLYCARBOXYLIC ACID RESIN COMPOSITION COMPRISING THE SAME, EPOXY RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF THE SAME, AND SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a polycarboxylic acid resin that has a low refractive index and high sulfur resistance, from which a cured product of high transparency can be obtained.SOLUTION: The present invention provides a polycarboxylic acid resin represented by formula (1) (Xis a C1-20 divalent or trivalent organic group or a bond between T and O; if Xis the divalent organic group or the bond between T and O, m is 1, and if Xis the trivalent organic group, m is 2; Xis a C1-20 divalent organic group; T is a Si2-10 chain, branched, or cyclic siloxane skeleton which may have C, H, or N; n is an integer of 2-4).SELECTED DRAWING: Figure 1
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