MANUFACTURING METHOD OF MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING DEVICE OF MULTILAYER CERAMIC ELECTRONIC COMPONENT, CERAMIC ELEMENT BODY, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer ceramic electronic component capable of preventing short circuit failure between internal electrodes on the cut surface of a laminated sheet.;SOLUTION: In a manufacturing method of a multilayer ceramic electronic component according to an embodiment of the present invention, a laminated sheet having ceramic sheets laminated in uniaxial direction, and an internal electrode placed between the ceramic sheets is prepared. A laminated chip having a side face where the internal electrode is exposed, is manufactured by cutting the laminated sheet by using a cutting blade having a first face formed at the tip in uniaxial direction and tilting with a first angle for the uniaxial direction, a second face formed side by side with the first face in the uniaxial direction and tilting with a second angle smaller than the first angle for the uniaxial direction, and a curved surface connecting the first and second faces smoothly. A side margin is provided on the side face of the laminated chip.;SELECTED DRAWING: Figure 12;COPYRIGHT: (C)2017,JPO&INPIT