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Copper strips, plated with copper strips, lead frame and led module

机译:铜条,镀有铜条,引线框架和LED模块

摘要

The invention provide a copper strip capable of forming a surface plating layer with a higher reflectivity, a copper strip with the plating and a lead frame. According to the copper strip with a substrate plating growth surface, at least one of an amorphous zone or a zone formed by superfine grains is formed on the substrate plating growth surface according to the growth speed of the substrate plating in a manner that the substrate plating growth surface of the copper strip is uniform in surface.
机译:本发明提供了一种能够形成具有更高反射率的表面镀层的铜带,具有该镀层的铜带和引线框架。在具有基材镀敷生长面的铜带中,根据基材镀敷的生长速度,在基材镀敷生长面上形成非晶质区域或由超微粒子形成的区域中的至少一个,以使基材镀敷的方式进行。铜带的生长表面在表面上是均匀的。

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