MINUTE CRACKING FORMING METHOD AND MINUTE CRACKING FORMING DEVICE OF SEMICONDUCTOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a minute cracking forming method of a semiconductor substrate capable of efficiently obtaining chips of stable quality and a minute cracking forming device.;SOLUTION: The minute cracking forming method of a semiconductor substrate for forming, on a wafer inside which a modified area is formed by a laser beam, a minute cracking which becomes an originating point of cutting the wafer includes a grinding step for developing the minute cracking extending from the modified area by grinding the rear surface of the wafer in a state where a surface of the wafer is vacuum chucked to a table.;SELECTED DRAWING: Figure 15;COPYRIGHT: (C)2017,JPO&INPIT