Multifaceted with body of the lead frame, multifaceted with body of the resin with a lead frame, multifaceted with body of an optical semiconductor device

摘要

PROBLEM TO BE SOLVED: To provide a multiple mounted component of a lead frame capable of suppressing warpage occurrence, a multiple mounted component of a lead frame with a resin and a multiple mounted component of an optical semiconductor device.SOLUTION: A multiple mounted component MS of a lead frame has a plurality of terminal parts 11, 12, and a reflector 20a projecting to surface sides of terminal parts 11, 12 is formed. In the multiple mounted component MS of the lead frame in which a lead frame 10 used for an optical semiconductor device 1 in which an LED element 2 is connected to at least of one surface of terminal parts 11, 12, is multiple-mounted to a frame F, at least part of a rear surface of the frame F has a step D recessed with respect to rear surfaces of terminal parts 11, 12.