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Method for manufacturing III-nitride substrate and method for reducing dislocation density of III-nitride substrate

机译:III族氮化物衬底的制造方法和降低III族氮化物衬底的位错密度的方法

摘要

PROBLEM TO BE SOLVED: To provide a method for obtaining easily and surely a group III nitride substrate having a low dislocation density.SOLUTION: A production method of a group III nitride substrate includes: an etching step for forming a recessed part on the surface of a ground substrate so that a C-surface ratio becomes 20% or higher and 90% or lower, by applying chlorine plasma etching to the surface of the ground substrate whose surface is the flat C-surface in the state where a bias voltage is not applied to the ground substrate; and a formation step for forming a group III nitride layer on the ground substrate after the etching step.
机译:解决的问题:提供一种容易且可靠地获得具有低位错密度的III族氮化物衬底的方法。解决方案:III族氮化物衬底的制造方法包括:蚀刻步骤,用于在硅衬底的表面上形成凹陷部分。通过在未施加偏置电压的状态下对表面为平坦C面的接地基板的表面进行氯等离子体蚀刻,从而使C表面比率为20%以上且90%以下。应用于地面基底;在蚀刻步骤之后,在接地基板上形成III族氮化物层的形成步骤。

著录项

  • 公开/公告号JP6126887B2

    专利类型

  • 公开/公告日2017-05-10

    原文格式PDF

  • 申请/专利权人 日本碍子株式会社;

    申请/专利号JP20130070792

  • 发明设计人 岩田 雄一;角谷 茂明;倉岡 義孝;

    申请日2013-03-29

  • 分类号C30B29/38;C30B19/12;H01L21/3065;

  • 国家 JP

  • 入库时间 2022-08-21 13:55:18

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