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Feedthrough Of A Medical Electronic Device, Method For Producing Same, And Medical Electronic Device

机译:医用电子设备的馈通件,其制造方法以及医用电子设备

摘要

A feedthrough of a medical electronic device, which in particular is implantable, including a housing and at least one electrical or electronic component received in the housing, wherein the feedthrough has a feedthrough flange for closing an opening in the housing and for receiving a multiplicity of connection elements in an insulating body surrounding the connection elements, which connection elements serve for the connection of a component or at least one component, externally of the housing, wherein the insulating body is formed from multi-layer ceramic, in particular from HTCC, with sintered-in pre-configured conductor elements, and comprising a device-specific contact-making means of selected conductor elements, which together with the contacted pre-configured conductor elements forms the connection elements.
机译:尤其是可植入的医疗电子设备的馈通件,包括壳体和容纳在壳体中的至少一个电气或电子部件,其中,馈通件具有馈通法兰,用于封闭壳体中的开口并容纳多个壳体。在围绕连接元件的绝缘体中的连接元件,该连接元件用于在壳体的外部连接一个部件或至少一个部件,其中,绝缘体由多层陶瓷,特别是由HTCC制成,并且烧结的预先配置的导体元件,并且包括所选导体元件的设备特定的接触形成装置,其与接触的预先配置的导体元件一起形成连接元件。

著录项

  • 公开/公告号US2017203105A1

    专利类型

  • 公开/公告日2017-07-20

    原文格式PDF

  • 申请/专利权人 BIOTRONIK SE & CO. KG;

    申请/专利号US201615389547

  • 申请日2016-12-23

  • 分类号A61N1/375;H01R13/52;A61N1/39;H01R13/523;A61N1/36;A61N1/362;

  • 国家 US

  • 入库时间 2022-08-21 13:52:24

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