INTERCONNECT SYSTEMS AND METHODS USING HYBRID MEMORY CUBE LINKS TO SEND PACKETIZED DATA OVER DIFFERENT ENDPOINTS OF A DATA HANDLING DEVICE

摘要

System on a Chip (SoC) devices include two packetized memory buses for conveying local memory packets and system interconnect packets. In an in-situ configuration of a data processing system two or more SoCs are coupled with one or more hybrid memory cubes (HMCs). The memory packets enable communication with local HMCs in a given SoC's memory domain. The system interconnect packets enable communication between SoCs and communication between memory domains. In a dedicated routing configuration each SoC in a system has its own memory domain to address local HMCs and a separate system interconnect domain to address HMC hubs, HMC memory devices, or other SoC devices connected in the system interconnect domain.