首页> 外国专利> WIRING STRUCTURE, MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, METHOD FOR MANUFACTURING MEMS DEVICE, METHOD FOR MANUFACTURING LIQUID EJECTING HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTING APPARATUS

WIRING STRUCTURE, MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, METHOD FOR MANUFACTURING MEMS DEVICE, METHOD FOR MANUFACTURING LIQUID EJECTING HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTING APPARATUS

机译:布线结构,MEMS装置,液体喷射头,液体喷射装置,制造MEMS装置的方法,制造液体喷射头的方法和制造液体喷射装置的方法

摘要

A wiring structure includes a connecting terminal array formed on a first substrate and a connected terminal array formed on a second substrate, which are electrically connected, wherein a dummy terminal that is not used for transmission and reception of an electrical signal is provided on at least one end of the connecting terminal array in a terminal arrangement direction, and an anisotropic conductive film containing a conductive particle which is disposed between the first substrate and the second substrate extends to the dummy terminal such that an end of the anisotropic conductive film is located on a surface of the dummy terminal.
机译:布线结构包括电连接在第一基板上形成的连接端子阵列和第二基板上形成的连接端子阵列,其中,至少在其上设置不用于电信号的发送和接收的虚设端子。连接端子阵列在端子排列方向上的一端,并且布置在第一基板和第二基板之间的包含导电颗粒的各向异性导电膜延伸至虚设端子,使得各向异性导电膜的一端位于虚设端子的表面。

著录项

  • 公开/公告号US2017144438A1

    专利类型

  • 公开/公告日2017-05-25

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORPORATION;

    申请/专利号US201615354864

  • 发明设计人 MASUMI HAYAKAWA;TAKASHI KATO;

    申请日2016-11-17

  • 分类号B41J2/14;B81C3/00;B81B7/00;

  • 国家 US

  • 入库时间 2022-08-21 13:50:42

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