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System and method for assessing inhomogeneous deformations in multilayer plates
System and method for assessing inhomogeneous deformations in multilayer plates
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机译:用于评估多层板中不均匀变形的系统和方法
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摘要
A method and device for evaluating inhomogeneous deformations in a first wafer bonded by molecular adhesion to a second wafer. This evaluation method includes the steps of making at least one reading of a plurality of measurement points, the reading corresponding to a surface profile of the first wafer along a predefined direction and over a predefined length, computing a second derivative from the measurement points of the surface profile and evaluating a level of inhomogeneous deformations in the first wafer according to the second derivative.
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