BOARD-EDGE INTERCONNECTION MODULE WITH INTEGRATED CAPACITIVE COUPLING FOR ENABLING ULTRA-MOBILE COMPUTING DEVICES

摘要

A board-edge interconnection module features integrated capacitive coupling, which enables a board design employing the module to avoid having AC capacitors and flexible cables with bulky connectors. The recovered real estate enables further miniaturization, enabling the component to be used on a wide variety of devices, including ultra-mobile computing devices.