Disclosed herein are compositions comprising a dispersion of solid particles of a substantially insoluble copper compound in an amount from 0.001% to 10% by weight of the composition; a boron-containing compound, a fluoride-containing compound, or a combination thereof; and an aqueous carrier; wherein the composition has a viscosity of 125 to 425 tenths of a millimeter (tmm) as measured using a penetrometer, and wherein at least 20% of the particles of the composition comprise particles having particle size greater than 25 microns. Also disclosed herein are methods of making and using the same.
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