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Systems and methods for full-order equivalent circuit approach (ECA) modeling of layered structures

机译:用于分层结构的全阶等效电路方法(ECA)建模的系统和方法

摘要

Systems and methods are provided for generating an equivalent circuit model. RLGC parameters representing a segment of a layered structure of a specified length are received. The layered structure includes two conductors (also called planes) and at least one trace or a transmission line located between the two conductors. An admittance matrix corresponding to the segment is computed based at least in part on the received RLGC parameters. One or more loading parameters representing a loading of one of the two conductors due to the trace or traces are also computed, and a segment circuit model for the segment of the layered structure based at least in part on the admittance matrix and the one or more loading parameters.
机译:提供了用于生成等效电路模型的系统和方法。接收表示指定长度的分层结构的一部分的RLGC参数。分层结构包括两个导体(也称为平面)和位于两个导体之间的至少一条走线或传输线。至少部分地基于所接收的RLGC参数来计算与所述片段相对应的导纳矩阵。还计算表示由于一条或多条迹线导致的两个导体之一的负载的一个或多个负载参数,并且至少部分基于导纳矩阵和一个或多个,用于分层结构的分段的分段电路模型。加载参数。

著录项

  • 公开/公告号US9715567B1

    专利类型

  • 公开/公告日2017-07-25

    原文格式PDF

  • 申请/专利权人 SAS IP INC.;

    申请/专利号US201514796427

  • 发明设计人 XIN XU;J. E. BRACKEN;WERNER THIEL;

    申请日2015-07-10

  • 分类号G06F17;G06F17/50;

  • 国家 US

  • 入库时间 2022-08-21 13:44:46

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