Use of hydrophobic epoxide resin system for encapsulation of a instrument transformer

摘要

Disclosed is the use of a curable composition for padding-free encapsulation of instrument transformers comprising (a) a cycloaliphatic epoxy resin, (b) a polyoxyalkylene diglycidylether (c) an OH-terminated polysiloxane, (d) a cyclic polysiloxane and (e) a non-ionic, fluoroaliphatic surface-active reagent, (f) a filler, (g) a hardener selected from anhydrides, (h) a curing accelerator selected from accelerators for anhydride curing of epoxy resins.