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High density microwave plasma generation apparatus, and magnetron sputtering deposition system using the same

机译:高密度微波等离子体产生装置以及使用该装置的磁控溅射沉积系统

摘要

A microwave plasma generation apparatus (4) includes: a rectangular waveguide (41) that transmits a microwave; a slot antenna (42) that has a slot (420) through which the microwave passes; and a dielectric portion (43) that is arranged so as to cover the slot (420) and of which a plasma generating region-side front face is parallel to an incident direction in which the microwave enters from the slot (420). The microwave plasma generation apparatus (4) is able to generate microwave plasma (P1) under a low pressure of lower than or equal to 1 Pa. A magnetron sputtering deposition system (1) includes the microwave plasma generation apparatus (4), and carries out film deposition using magnetron plasma (P2) while radiating microwave plasma (P1) between a base material (20) and a target (30). With the magnetron sputtering deposition system (1), it is possible to form a thin film having small asperities on its surface.
机译:微波等离子体产生装置( 4 )包括:透射微波的矩形波导管( 41 );和缝隙天线( 42 ),其具有缝隙( 420 ),微波通过缝隙( 420 );电介质部分( 43 )被布置为覆盖狭缝( 420 ),并且其等离子体产生区域侧的前表面平行于入射方向微波从插槽( 420 )进入。微波等离子体产生设备( 4 )能够在低于或等于1 Pa的低压下产生微波等离子体(P 1 )。磁控溅射沉积系统( 1 )包括微波等离子体产生装置( 4 ),并在辐射微波等离子体的同时使用磁控管等离子体(P 2 )进行膜沉积基材( 20 )和靶材( 30 )之间的(P 1 )。利用磁控溅射沉积系统( 1 ),可以在其表面上形成具有小的凹凸的薄膜。

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