首页> 外国专利> The composition of the formulation of epoxy resin curable composition, a process for preparing a formulation of a curable epoxy resin, a process for preparing an insulating material of epoxy and product.

The composition of the formulation of epoxy resin curable composition, a process for preparing a formulation of a curable epoxy resin, a process for preparing an insulating material of epoxy and product.

机译:环氧树脂可固化组合物的制剂的组成,可固化环氧树脂的制剂的制备方法,环氧树脂和产品的绝缘材料的制备方法。

摘要

Summary "formulation of epoxy resin curable composition, process for preparing a composition or formulation of epoxy resin curable.Process for preparing an insulating material of epoxy and the product a composition or formulation of epoxy resin curable useful as electrical insulation for an electrical appliance comprising (a) at least one divinyl dioxide sandy; (b) at least one epoxy resin different from the dioxide of D. Ivinil sandy component (a); (c) at least one anhydride hardener; and (d) at least one load; and (E) at leastThe catalyst cure; and the composition of the formulation of epoxy resin after curing provides a cured product with a necessary balance of electrical properties, mechanical, and thermal, such as TG, tensile strength, dielectric strength and volume resistivity, t. Al the cured product can be used in applications operated at a temperature greater than or equal to 1 100 u00b0 C.
机译:发明内容“环氧树脂可固化组合物的配制,环氧树脂可固化的组合物或配制物的制备方法。环氧树脂绝缘材料的制备方法和环氧树脂可固化的组合物或配制物的产品,其可用作用于电气设备的电绝缘,包括(a)至少一种二乙烯基二氧乙烯沙土;(b)至少一种不同于D. Ivinil沙状组分的二氧化物的环氧树脂(a);(c)至少一种酸酐硬化剂;和(d)至少一种负载; (E)至少催化剂固化;以及固化后的环氧树脂制剂的组成为固化产物提供了电,机械和热(例如TG),拉伸强度,介电强度和体积电阻率的必要平衡, t。固化后的产品可用于温度大于或等于1100℃的应用中。

著录项

  • 公开/公告号BR112013029224A2

    专利类型

  • 公开/公告日2017-03-14

    原文格式PDF

  • 申请/专利权人 DOW GLOBAL TECHNOLOGIES LLC;

    申请/专利号BR20131129224

  • 发明设计人 MOHAMED ESSEGHIR;WILLIAM J. HARRIS;

    申请日2012-04-13

  • 分类号C08G59/22;C08G59/24;C08G59/42;C08L63;H01B3/40;

  • 国家 BR

  • 入库时间 2022-08-21 13:40:45

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