Thermoplastic composition reticulu00e1vel semiconductor free of peroxide, process for preparing a cross-linked thermoplastic article semiconductor process line and granule.

摘要

Summary "thermoplastic composition reticulu00e1vel semiconductor free of peroxide, process for preparing a semiconductor article thermoplastic crosslinked.In line with "process and thermoplastic compositions reticulu00e1veis semiconductor free of peroxide, having a stable volume resistivity of less than 1000 ohm cm, comprisingBased on the weight of the composition: A. 60 - 90% by weight of polyethylene functionalised with silane; B. 0.5 to 20% by weight of organopolissiloxano containing two or more functional end groups; C.Of 10 to 20% by weight of carbon black of high conductivity, such as for example, a carbon black having an average particle size of 50 nm or less.A surface area (BET) 700 - 800 m2 / g and an oil absorption (DBP) of 300 - 500 ml / 100 g; and D. 0,05 u2013 0,2% by weight of catalyst, crosslinking agent. 1 / 1