首页>
外国专利>
PROCESS FOR TEXTURING THE SURFACE OF A SILICON SUBSTRATE, STRUCTURED SUBSTRATE AND PHOTOVOLTAIC DEVICE COMPRISING SUCH A STRUCTURED SUBSTRATE.
PROCESS FOR TEXTURING THE SURFACE OF A SILICON SUBSTRATE, STRUCTURED SUBSTRATE AND PHOTOVOLTAIC DEVICE COMPRISING SUCH A STRUCTURED SUBSTRATE.
展开▼
机译:对硅基质,结构化基质和包含这种结构化基质的光伏装置进行表面纹理化的过程。
展开▼
页面导航
摘要
著录项
相似文献
摘要
The invention relates to a process for texturing the surface of a silicon substrate, comprising a step of exposing said surface to an MDECR plasma generated, at least from argon, using between 1.5 W/cm2 and 6.5 W/cm2 of plasma power in a matrix distributed electron cyclotron resonance plasma source, the substrate bias being between 100 V and 300 V.
展开▼
机译:本发明涉及一种用于使硅衬底的表面纹理化的方法,该方法包括以下步骤:使用矩阵中的1.5W / cm 2至6.5W / cm 2的等离子功率,使所述表面暴露于至少由氩气产生的MDECR等离子体。分布式电子回旋共振等离子体源,基板偏置电压在100 V至300 V之间。
展开▼