首页> 外国专利> SILICON NITRIDE POWDER, SILICON NITRIDE SINTERED BODY AND CIRCUIT SUBSTRATE, AND PRODUCTION METHOD FOR SAID SILICON NITRIDE POWDER

SILICON NITRIDE POWDER, SILICON NITRIDE SINTERED BODY AND CIRCUIT SUBSTRATE, AND PRODUCTION METHOD FOR SAID SILICON NITRIDE POWDER

机译:氮化硅粉,氮化硅烧结体和电路基质以及制备的氮化硅粉的生产方法

摘要

The present invention addresses the problem of providing: a silicon nitride sintered body and a circuit substrate which exhibit both high mechanical strength and high thermal conductivity; a silicon nitride powder used as a starting material for these; and a production method for the silicon nitride powder. Provided is a silicon nitride powder which has a specific surface area of 4.0-9.0 m 2 /g, a ² phase ratio of less than 40%, and an oxygen content of 0.20-0.95 mass%, said silicon nitride powder wherein: the frequency distribution curve obtained from a volume-based particle size distribution measurement performed using laser diffraction scattering has two peaks; the tops of the peaks are within the range of 0.4-0.7 µm, and within the range of 1.5-3.0 µm respectively; the ratio (the frequency of the top of the peak in the particle size range of 0.4-0.7 µm/the frequency of the top of the peak in the particle size range of 1.5-3.0 µm) of the frequencies of the tops of the peaks is 0.5-1.5; and the ratio (D50/D BET ) (µm/µm) of the median diameter (D50) (µm) obtained from the particle size distribution measurement, to the specific surface area equivalent diameter (D BET ) (µm) calculated from the specific surface area is at least 3.5. Also provided are: a silicon nitride sintered body and a circuit substrate which are obtained from the silicon nitride powder; and a production method for the silicon nitride powder.
机译:本发明解决了提供以下问题:提供了既具有高机械强度又具有高导热性的氮化硅烧结体和电路基板。用作这些原料的氮化硅粉末;以及氮化硅粉末的制造方法。提供了一种氮化硅粉末,其比表面积为4.0-9.0m 2 / g,²相比小于40%,并且氧含量为0.20-0.95质量%,所述氮化硅粉末其中:通过使用激光衍射散射进行的基于体积的粒度分布测量而获得的分布曲线具有两个峰。峰的顶部分别在0.4-0.7μm的范围内,并且在1.5-3.0μm的范围内。峰顶频率的比值(0.4-0.7 µm的粒径范围内的峰顶频率/ 1.5-3.0 µm的粒径范围内的峰顶频率)是0.5-1.5;以及通过粒度分布测量获得的中值直径(D50)(μm)的比值(D50 / D BET)(μm/μm)与由比值计算的比表面积等效直径(D BET)(μm)表面积至少为3.5。还提供:由氮化硅粉末获得的氮化硅烧结体和电路基板;以及氮化硅粉末的制造方法。

著录项

  • 公开/公告号SG11201610089QA

    专利类型

  • 公开/公告日2017-01-27

    原文格式PDF

  • 申请/专利权人 UBE INDUSTRIES LTD.;

    申请/专利号SG11201610089Q

  • 发明设计人 YAMAO TAKESHI;HONDA MICHIO;JIDA SHINSUKE;

    申请日2015-06-16

  • 分类号C01B21/068;C04B35/584;C04B35/626;

  • 国家 SG

  • 入库时间 2022-08-21 13:36:02

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