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Process for the preparation of polycrystalline structures having improved mechanical and physical properties

机译:具有改善的机械和物理性能的多晶结构的制备方法

摘要

A method of making an article, the method comprising the steps of: a) electrodeposition of a metallic material comprising copper from an aqueous electrolyte comprising copper pyrophosphate using metallization current (DC) current pulse (PP ) and / or metallization reverse pulse (PR) using an average current density ranging from 5 to 10,000 mA / cm2, a service time by direct pulse ranges from 0.1 to 500 ms, a rest period that It ranges from 0 to 10,000 ms, a time of service reverse pulse varying from 0 to 500 ms, a density of maximum forward current that ranges from 5 to 10,000 mA / cm2, a density of reverse current 10 maximum ranging from 5-20000 mA / cm2, a frequency that varies from 0 to 1000 Hz and a duty cycle ranging from 5 to 100%, to form or at least partially metalized article having the metallic material i) size average grain between 4 nm and 5 microns, and ii ) A content of impurities less than 20 ppm by weight of S, less than 50 ppm by weight of O, less than 50 ppm by weight of P and less than 300 ppm by weight of C; b) heat treatment of the electrodeposited metallic material at a temperature between 20 K 0,7Tm 0,25Tm and for a period of time between 1 second and 75 hours to induce grain growth in the metallic material such that at least one portion of metal material shows an increase of at least 0.3 of the fraction of special grain boundary and an intensity value of the crystallographic texture of less than 7.5 times the random.
机译:一种制造物品的方法,该方法包括以下步骤:a)使用金属化电流(DC)电流脉冲(PP)和/或金属化反向脉冲(PR)从包含焦磷酸铜的水性电解质中电沉积包含铜的金属材料。使用5至10,000 mA / cm2的平均电流密度,直接脉冲的使用时间范围为0.1至500 ms,休息时间范围为0至10,000 ms,反向脉冲的使用时间范围为0至500 ms,最大正向电流密度范围为5至10,000 mA / cm2,反向电流10最大密度范围为5-20000 mA / cm2,频率从0至1000 Hz不等,占空比为5到100%,以形成或至少部分金属化的物品,其具有金属材料i)尺寸平均晶粒在4 nm和5微米之间,以及ii)杂质含量小于20重量ppm的S,小于50重量ppm的S的O,按重量计小于50 ppm P的含量小于300ppm(重量)的C; b)在20 K 0,7Tm 0,25Tm之间的温度下进行电沉积金属材料的热处理,时间为1秒至75小时,以引起金属材料中晶粒的生长,从而使至少一部分金属材料显示出至少0.3%的特殊晶界分数增加,并且结晶织构的强度值小于随机数的7.5倍。

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